Capa

A GUIDE TO LEAD-FREE SOLDERS IBD

SPRINGER
10 / 2010
9781849965774
Inglês

Sinopse

to Solder Alloys and Their Properties.- Packaging Architecture and Assembly Technology.- Wetting and Joint Formation.- Microstructural Instability in Solders.- Intermetallic Formation and Growth.- Mechanical Properties and Creep Behavior.- Thermomechanical Fatigue.- Product Assurance.